刊物

Interferometric surface inspection with movable measurement spot.

Complete 3D measurement of objects using white light interference in mass…

When chips are disassembled, a process known as depaneling, precision down to the micrometer is required in both processing and positioning. The…

Heye International´s Mark Ziegler and Gerd Schütz discuss the importance of wall thickness measurement in the high speed manufacture of lightweight…