刊物
PCB-Separation: Controlling ultrashort pulse laser using chromatic-confocal sensors
When chips are disassembled, a process known as depaneling, precision down to the micrometer is required in both processing and positioning. The…
Contactless 3D measurement with multi-point sensors
Heye International´s Mark Ziegler and Gerd Schütz discuss the importance of wall thickness measurement in the high speed manufacture of lightweight…
Wall thickness measurement for non-round ware
Heidi Olson describes an optical probe, designed by Precitec Optronik for the wall thickness measurement of non-round containers. Using a specialized…
